Weibo is abuzz with talk that Huawei’s HiSilicon is in the advanced stages of developing its next-generation chipset, which will be manufactured on a 3nm node. The source of this appears to be leakster Teme (RODENT950), who dubbed the chip the Kirin 9010. While Huawei (and all other chipset makers) are undoubtedly planning for the 3nm future, those really are future plans instead of something for later this year – TSMC has stated that it plans to start volume production of 3nm chips in the second half of 2022. And TSMC is the most likely foundry for the next Kirin chip, especially if it is...
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Rumors of Kirin 9010 built on 3 nm surface, but that's not happening (this year)
![Rumors of Kirin 9010 built on 3 nm surface, but that's not happening (this year)]()
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January 04, 2021
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